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Quick Intelligent Equipment (603203.SH): is currently developing advanced packaging bonding equipment, with prototype development expected to be completed by 2025.
On December 11, at Gelonghui, Quick Intelligent Equipment (603203.SH) stated on the interactive platform that the demand for AI Chips continues to increase, and the current localization rate of thermal press bonding and hybrid bonding equipment involved in advanced packaging is very low. The company is actively laying out the high-end equipment field for advanced packaging and is developing advanced packaging bonding equipment, expecting to complete the prototype development by 2025.
The Recent CN¥401m Market Cap Decrease Is Likely to Have Disappointed Insiders Invested in Quick Intelligent Equipment Co.,Ltd. (SHSE:603203)
Quick Intelligent EquipmentLtd's (SHSE:603203) Earnings Growth Rate Lags the 15% CAGR Delivered to Shareholders
Quick Smart: Quick Smart 2024 Third Quarter Report
Quick Smart 2024 Third Quarter Report
Quick Intelligent Equipment (603203.SH) released its performance for the first three quarters, with a net income of 0.163 billion yuan, a year-on-year increase of 4.33%.
Quick Intelligent Equipment (603203.SH) released the report for the first three quarters of 2024, during the reporting period the company achieved revenue...
Quick Intelligent EquipmentLtd's (SHSE:603203) Earnings Trajectory Could Turn Positive as the Stock Rises 10.0% This Past Week
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