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Bomin Electronics (603936.SH): Products have been used in fields related to floor sweeping robots and other related fields.
On July 5th, Gelonhui reported that an investor asked Bomin Electronics (603936.SH) on the investor interactive platform, "Can the company's products be used for robots?" The company replied that its main products are high-density interconnect (HDI) boards, high-frequency high-speed boards, multilayer boards, rigid-flex boards (including flexible circuit boards) and other special specification boards (including: metal substrate boards, thick copper boards, ultra-long boards, etc.). The company has the ability to provide customers with one-stop "PCB+ components + solutions" services, which are widely used in new energy/automotive electronics, data/communications, intelligent terminals, and industrial control security fields. The field of robots you mentioned is also included.
Bomin Electronics (603936.SH): Spiral inductors are a new type of integrated molded inductors.
On June 21, Gelonhui reported that Bomin Electronics (603936.SH) stated on the investor interaction platform that spiral inductors are a new type of integrated inductor, which uses a ceramic substrate process method. The company has delivered small batches for use in related application fields.
Bomin Electronics (603936.SH): has obtained a small batch order from AI PC customers.
On June 21st, Gelonghui reported that Bomin Electronics (603936.SH) stated on the investor interaction platform that 2024 will be the first year of AI phones and AI PCs. Any product has a research and certification cycle from its inception to market. The company has already obtained small orders from AI PC customers and is in the process of production and delivery.
After the IC packaging carrier line of Bomin Electronics (603936.SH) reaches full capacity, it will produce approximately 10,000 square meters per month.
On June 21st, Geelong reported that according to Prismark data, the global IC substrate output value in 2023 will be USD 12.498 billion, a year-on-year decrease of 28.2%, and the largest category with the biggest decline in PCB product categories. With the commissioning and capacity climb of the Bomin Electronics Phase II smart factory in Jiangsu, the newly-added fine line mSAP process packaging substrate and coreless substrate process packaging substrate have entered the operation stage on the basis of the original Tenting process packaging substrate production line, marking that the company officially has the ability to enter the medium and high-end IC packaging substrate market.
Bomin Electronics (603936.SH): its products are widely used in fields such as intelligent driving and vehicle networking.
On June 21, Gelonghui reported that Bomin Electronics (603936.SH) stated on the investor interaction platform that the development of "vehicle-road cloud integration" is closely related to the intelligence and networking of automobiles. PCB products play an important role in the field of "vehicle-road cloud integration", and can mainly be applied to vehicle intelligent systems, vehicle networking communication modules, automatic driving sensors, and cloud platform data processing and storage devices. Bomin Electronics focuses on high-precision, high-reliability PCB research and development and manufacturing, and has a wealth of automotive PCB product lines. Its products are widely used in intelligent driving and vehicle networking and other fields. In the "vehicle-road cloud integration", the company will...
Bomin Electronics Co., Ltd.'s (SHSE:603936) Business And Shares Still Trailing The Industry
Bomin Electronics Co., Ltd.'s (SHSE:603936) price-to-sales (or "P/S") ratio of 1.6x might make it look like a strong buy right now compared to the Electronic industry in China, where around half of th
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