603936 Bomin Electronics
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Bomin Electronics News
Bomin Electronics (603936.SH): The current customers supplied with Switch PCBs mainly include a representative group of clients such as H, New H3C, and Inspur.
On December 13, Glonghui reported that Bomin Electronics (603936.SH) stated on the investor interaction platform that driven by the wave of AI, the company sees tremendous opportunities in the computing power PCB market. Currently, the company’s 400G Switch and data connection products have achieved mass production capabilities. The customers for Switch PCBs primarily include major clients such as H, New H3C, and Inspur. The data connection PCBs have already gained recognition from several top customers in the Datacenter and AI fields, achieving bulk shipments of various high, medium, and low-end products. Looking forward to the second half of the year, accompanied by the continuous improvement in the maturity of high-end products and the onboarding of new customers.
Bomin Electronics: Bomin Jiangsu's production capacity utilization rate is about 90%, and the first phase of the investment project is expected to start trial operation at the end of the year | Direct hit on earnings conference
bomin electronics stated that the new generation of electronic information industry investment expansion project (Phase I) 3# plant has been basically completed, and if there are no other factors interfering, it is expected that some processes will enter the trial operation state by the end of the year. bomin electronics chairman and general manager Xu Huan stated that the comprehensive production capacity utilization rate of Jiangsu bomin is around 90% currently, showing an upward trend following the industry's recovery.
Bomin Electronics (603936.SH): A wholly-owned subsidiary intends to transfer part of the business related assets and liabilities to the company.
On November 18, Gelonghui reported that bomin electronics (603936.SH) announced that its wholly-owned subsidiary in Shenzhen currently engages in PCB business as well as the research, production, and sales of power semiconductor ceramic substrates and passive components. Shenzhen bomin has leading active metal brazing (AMB) ceramic substrate process technology and production flow both domestically and internationally. The ceramic substrates produced using self-developed brazing formulas exhibit superior performance, reliable quality, and competitive cost, meeting the reliability performance requirements of aviation and aerospace. The products have been certified for metro-level, industrial-level, and automotive-level applications, and are gradually being used in head third-generation semiconductors power modules.
Bomin Electronics: Bomin Electronics Report for the Third Quarter of 2024
Bomin Electronics Report for the Third Quarter of 2024
Bomin Electronics (603936.SH): AMB ceramic substrates are gradually being mass-produced and applied in the top enterprises of the third-generation semiconductors power module.
Bomin Electronics (603936.SH) stated on the investor interaction platform on October 18th that the company's AMB ceramic substrates are gradually being used in mass production applications by leading enterprises in the third-generation semiconductor power module sector. At the same time, they are expanding to other leading enterprises domestically and internationally, as well as overseas automotive supply chains. They have also received small batch deliveries, passed certifications, engaged in designated developments, and increased their production capacity to 0.15 million sheets per month. Currently, the production capacity utilization rate is gradually increasing, and the shipment volume has increased compared to last year.
Even After Rising 20% This Past Week, Bomin Electronics (SHSE:603936) Shareholders Are Still Down 46% Over the Past Five Years
Bomin Electronics to Fully Acquire Circuit Board-Making Subsidiary for 250 Million Yuan; Shares Up 4%
bomin electronics (603936.SH): The actual controller and senior management personnel have not yet increased their shareholding in the company.
Bomin Electronics (603936.SH) announced on September 20th that as of the date of this announcement, due to personal funding arrangements, market fluctuations, and previous plans for equity acquisitions, the actual controlling shareholders and senior executives of the company have not increased their shareholding. The shareholding plan has not been fully implemented yet. The actual controlling shareholders and senior executives of the company are confident in the future development prospects of the company and recognize its long-term investment value. They will seize the opportunity to increase their shareholding in the company during the subsequent shareholding plan period and timely complete this shareholding plan.
bomin electronics (603936.SH): proposes to acquire 86.8535% equity of Ben Creation Electronics for no more than 0.25 billion yuan.
On September 20, Gelonhui revealed that Bomin Electronics (603936.SH) announced the signing of the "Framework Agreement on the Acquisition of Meizhou Bensheng Electronics Co., Ltd." with Ms. Xiong Dongmei, a shareholder of Bensheng Electronics, in order to cultivate high-quality outsourced suppliers, optimize and enhance the efficiency and quality of the company's outsourced service procurement, reduce the cost of outsourced procurement. Considering the good expectations of future synergistic win-win development in business, customers, production capacity, etc., between the two parties, the company plans to acquire Bensheng Electronics for no more than 250 million yuan in cash.
bomin electronics (603936.SH): The company's HDI products for mobile phones are currently mainly used in non-folding screen phones.
Bomin Electronics (603936.SH) stated on the investor interaction platform on September 6th that the company's HDI products for mobile phones are currently focused on non-foldable screen phones. 2024 is the beginning of AI phone applications, and the company is actively exploring the AI phone field with its customers and seizing new business opportunities emerging in the market. It will further consolidate its market share in related markets, continuously optimize its product structure, deeply integrate factory resources, and respond to price competition and the constantly upgrading product demands. Most of Jiangsu Bomin's products, mainly high-end HDI products, are concentrated in the fields of mobile phones and laptops, and they are currently benefiting from...
Bomin Electronics 2024 Half-Year Report
Summary of Bomin Electronics' 2024 interim report
Bomin Electronics (603936.SH): The net income in the first half of the year was 55.2228 million yuan, a year-on-year decrease of 23.37%.
Bomin Electronics (603936.SH) announced its interim report for the first half of 2024, with revenue of 1.513 billion yuan, a decrease of 0.03% compared to the same period last year; net income attributable to shareholders of the listed company was 55.2228 million yuan, a decrease of 23.37% year-on-year; net income attributable to shareholders of the listed company after deducting non-recurring gains and losses was 32.5627 million yuan, a decrease of 45.99% year-on-year; and basic earnings per share was 0.09 yuan.
Bomin Electronics (603936.SH): Chairman of the Supervisory Board, Xin Feng, resigns.
On July 30th, Gelunhui announced that, recently, the company's supervisory board received the resignation application submitted by the chairman of the supervisory board, Mr. Xinfeng, who requested to resign from the fifth supervisory board chairmanship and supervisory duties due to personal reasons. After the resignation, he will no longer hold any position in the company. Considering that Mr. Xinfeng's resignation will result in the number of supervisory board members being lower than the statutory minimum number, in order to ensure the normal operation of the company's supervisory board in accordance with the relevant provisions of the Company Law and the Company Articles of Association, Mr. Xinfeng will continue to perform his duties until a new supervisor is elected at the company's shareholder meeting.
Is Bomin Electronics (SHSE:603936) Using Too Much Debt?
Bomin Electronics (603936.SH): Products have been used in fields related to floor sweeping robots and other related fields.
On July 5th, Gelonhui reported that an investor asked Bomin Electronics (603936.SH) on the investor interactive platform, "Can the company's products be used for robots?" The company replied that its main products are high-density interconnect (HDI) boards, high-frequency high-speed boards, multilayer boards, rigid-flex boards (including flexible circuit boards) and other special specification boards (including: metal substrate boards, thick copper boards, ultra-long boards, etc.). The company has the ability to provide customers with one-stop "PCB+ components + solutions" services, which are widely used in new energy/automotive electronics, data/communications, intelligent terminals, and industrial control security fields. The field of robots you mentioned is also included.
Bomin Electronics (603936.SH): Spiral inductors are a new type of integrated molded inductors.
On June 21, Gelonhui reported that Bomin Electronics (603936.SH) stated on the investor interaction platform that spiral inductors are a new type of integrated inductor, which uses a ceramic substrate process method. The company has delivered small batches for use in related application fields.
Bomin Electronics (603936.SH): has obtained a small batch order from AI PC customers.
On June 21st, Gelonghui reported that Bomin Electronics (603936.SH) stated on the investor interaction platform that 2024 will be the first year of AI phones and AI PCs. Any product has a research and certification cycle from its inception to market. The company has already obtained small orders from AI PC customers and is in the process of production and delivery.
After the IC packaging carrier line of Bomin Electronics (603936.SH) reaches full capacity, it will produce approximately 10,000 square meters per month.
On June 21st, Geelong reported that according to Prismark data, the global IC substrate output value in 2023 will be USD 12.498 billion, a year-on-year decrease of 28.2%, and the largest category with the biggest decline in PCB product categories. With the commissioning and capacity climb of the Bomin Electronics Phase II smart factory in Jiangsu, the newly-added fine line mSAP process packaging substrate and coreless substrate process packaging substrate have entered the operation stage on the basis of the original Tenting process packaging substrate production line, marking that the company officially has the ability to enter the medium and high-end IC packaging substrate market.
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