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Bomin Electronics (603936.SH): The current customers supplied with Switch PCBs mainly include a representative group of clients such as H, New H3C, and Inspur.
On December 13, Glonghui reported that Bomin Electronics (603936.SH) stated on the investor interaction platform that driven by the wave of AI, the company sees tremendous opportunities in the computing power PCB market. Currently, the company’s 400G Switch and data connection products have achieved mass production capabilities. The customers for Switch PCBs primarily include major clients such as H, New H3C, and Inspur. The data connection PCBs have already gained recognition from several top customers in the Datacenter and AI fields, achieving bulk shipments of various high, medium, and low-end products. Looking forward to the second half of the year, accompanied by the continuous improvement in the maturity of high-end products and the onboarding of new customers.
Bomin Electronics: Bomin Jiangsu's production capacity utilization rate is about 90%, and the first phase of the investment project is expected to start trial operation at the end of the year | Direct hit on earnings conference
bomin electronics stated that the new generation of electronic information industry investment expansion project (Phase I) 3# plant has been basically completed, and if there are no other factors interfering, it is expected that some processes will enter the trial operation state by the end of the year. bomin electronics chairman and general manager Xu Huan stated that the comprehensive production capacity utilization rate of Jiangsu bomin is around 90% currently, showing an upward trend following the industry's recovery.
Bomin Electronics (603936.SH): A wholly-owned subsidiary intends to transfer part of the business related assets and liabilities to the company.
On November 18, Gelonghui reported that bomin electronics (603936.SH) announced that its wholly-owned subsidiary in Shenzhen currently engages in PCB business as well as the research, production, and sales of power semiconductor ceramic substrates and passive components. Shenzhen bomin has leading active metal brazing (AMB) ceramic substrate process technology and production flow both domestically and internationally. The ceramic substrates produced using self-developed brazing formulas exhibit superior performance, reliable quality, and competitive cost, meeting the reliability performance requirements of aviation and aerospace. The products have been certified for metro-level, industrial-level, and automotive-level applications, and are gradually being used in head third-generation semiconductors power modules.
Bomin Electronics: Bomin Electronics Report for the Third Quarter of 2024
Bomin Electronics Report for the Third Quarter of 2024
Bomin Electronics (603936.SH): AMB ceramic substrates are gradually being mass-produced and applied in the top enterprises of the third-generation semiconductors power module.
Bomin Electronics (603936.SH) stated on the investor interaction platform on October 18th that the company's AMB ceramic substrates are gradually being used in mass production applications by leading enterprises in the third-generation semiconductor power module sector. At the same time, they are expanding to other leading enterprises domestically and internationally, as well as overseas automotive supply chains. They have also received small batch deliveries, passed certifications, engaged in designated developments, and increased their production capacity to 0.15 million sheets per month. Currently, the production capacity utilization rate is gradually increasing, and the shipment volume has increased compared to last year.