603960 Shanghai Kelai Mechatronics Engineering
- 20.31
- +0.49+2.47%
Shanghai Kelai Mechatronics Engineering News
Clayton Mechatronics: Klai Mechatronics 2021 Annual Equity Distribution Implementation Notice
Kerai Mechatronics 2021 Annual Equity Distribution Implementation Notice
Kelai Electromechanical: Announcement on the redemption results and changes in shares of “Kelai Convertible Bonds”
Kelai Mechatronics: Last indicative announcement on the redemption of “Kray Transfer Bonds”
Kelai Electromechanical: Eighth indicative announcement on the redemption of “Kray Transfer Bonds”
Kelai Mechatronics: Seventh indicative announcement on the redemption of “Kray Transfer Bonds”
Kelai Electromechanical: The sixth indicative announcement on the redemption of “Kray Transfer Bonds”
Kelai Electromechanical: Fifth indicative announcement on the redemption of “Kray Transfer Bonds”
Kelai Electromechanical: Third indicative announcement on the redemption of “Kray Transfer Bonds”
Kelai Electromechanical: Second indicative announcement on the redemption of “Kray Transfer Bonds”
Kelai Electromechanical: First indicative announcement on the redemption of “Kray Transfer Bonds”
Kelai Mechatronics: Announcement on the redemption of “Kray Transfer Bonds”
Kelai Electromechanical: Prompt announcement on early redemption of “Kelai Transfer Bonds”
Clayton Mechatronics: Announcement on 2020 tracking rating results for convertible corporate bonds
Kelai Electromechanical: Announcement on the reduction of the holding of the company's convertible corporate bonds by the controlling shareholder and actual controller
Kray Mechatronics: Online Roadshow Announcement on the Public Issuance of Convertible Corporate Bonds
Clayton Mechatronics: Summary of the Prospectus for the Public Issuance of Convertible Corporate Bonds
Clayton Mechatronics: Prospectus for the Public Issuance of Convertible Corporate Bonds
Kelai Mechatronics: Announcement on Responding to Questions Related to the Notice of Public Issuance of Convertible Corporate Bonds
Kelai Mechatronics: Response Report of Huatai United Securities Co., Ltd. to the feedback of Shanghai Kelai Mechatronics Automation Engineering Co., Ltd.'s public offering of convertible bond application documents (revised draft)
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