Soochow: Pursuing high-density interconnection, thermal compression bonding, and hybrid bonding as future trends in Semiconductors packaging. Strongly recommend Tuo Jing Technology (688072.SH) and others.

The thinning of wafers under advanced packaging has led to the emergence of temporary bonding and debonding technologies.

Zhitong FinanceMar 6 02:12 ET

Tuojing Technology (688072.SH) plans to launch a restricted stock incentive plan for 2025.

Tuo Jing Technology (688072.SH) has released a draft of the restricted stock incentive plan for 2025, proposing to incentivize...

Zhitong FinanceMar 5 06:45 ET

Tuojing Technology: 2024 Annual Results Report Announcement

SZSIFeb 27 11:00 ET · Announcements

2024 Annual Results Express Announcement

SZSIFeb 27 11:00 ET · Announcements

Express News | Piotech Prelim 2024 Net Profit up 3.9%

ReutersFeb 27 04:03 ET

Soochow: Domestic semiconductor equipment core technology breakthroughs have received international recognition, and the related equipment chain is迎迎增量增量增机会.

Soochow Securities recommends focusing on relevant symbols in the advanced packaging equipment chain.

Zhitong FinanceFeb 25 20:56 ET