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Kema Technology (301611.SZ): the main core ceramic component supplier for major domestic semiconductor equipment manufacturers such as Naura Technology Group, advanced micro-fabrication equipment inc. china, Tojing Technology, and Shanghai Microelectronic
Gelonghui September 25th | Kema Technology (301611.SZ) stated on the investor interaction platform that ceramic materials components are key components of semiconductor equipment, as well as consumables. The company is a major core ceramic component supplier for domestic mainstream semiconductor equipment manufacturers such as Naura Technology Group, Advanced Micro-Fabrication Equipment Inc. China, Topoint Technology, and Shanghai Micro Electronics.
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Tuojing Technology (688072.SH): has independently developed key bonding sleeve precision measurement products and has received customer orders.
Techfort Technology (688072.SH) stated on the interactive platform on September 20 that the company has independently developed and launched hybrid bonding equipment. Among them, wafer-to-wafer bonding equipment and chip-to-wafer surface pre-treatment equipment have passed customer verification in 2023, achieving industrial application and selling 3 units. In the first half of 2024, both products received repeat orders from customers. In addition, the company has independently developed bonding alignment accuracy measurement products and has obtained customer orders. The performance and capacity indicators of the company's wafer-to-wafer bonding equipment have reached the international leading level.
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In the first half of the year, Tuojing Technology's non-deductible net profit dropped by nearly 70%, but process verification and new signed orders have shown a positive trend.
During the reporting period, the newly signed sales orders and shipment amounts of Tuo Jing Technology increased significantly compared to the same period last year, and the new order volume in the second quarter also increased significantly compared to the first quarter. As of the end of the reporting period, the company has sufficient sales orders on hand. As of the end of this reporting period, the cumulative wafer production volume of the company's thin film deposition equipment on the client production line has exceeded 0.194 billion pieces.
2024 Semi-Annual Report
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