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Guangdong Leadyo IC Testing Co., Ltd. (688135.SH): its subsidiary exclusively provides wafer heterogeneous stacking and testing process technology services for Dicheng Optoelectronics' ultra-wide spectral stacking image sensor chips.
Guangdong Leadyo IC Testing Co., Ltd. (688135.SH) announced on August 19 that it has signed a strategic cooperation agreement with Shanghai Diecheng Optoelectronics Technology Co., Ltd. ("Diecheng Optoelectronics") in Shanghai on August 19, 2024. The core technology of Diecheng Optoelectronics is the "All-weather Wide-spectrum Layered Image Sensor Chip", and its wholly-owned subsidiary, Shanghai Guangtongxin Microelectronics Co., Ltd. ("Guangtongxin"), exclusively provides wafer-heterogeneous layering and testing services for Diecheng Optoelectronics' wide-spectrum layered image sensor chips. The wafer-heterogeneous layering process is complex and requires lithography machines, etching machines, thin film deposition, and other technology.
Guangdong Leadyo IC Testing Co., Ltd. (688135.SH) received a government subsidy of 4.8081 million yuan.
On July 31st, Gelonhui reported that Guangdong Leadyo IC Testing Co., Ltd., a wholly-owned subsidiary of the company, received a total of RMB 4.8081 million in government subsidies related to revenue on July 31, 2024.
Guangdong Leadyo IC Testing Co., Ltd. (688135.SH): Has established cooperation with Peaceful Head Brother (Shanghai) Semiconductor Technology Co., Ltd.
On July 29th, Gelunhui reported that Guangdong LeadYo IC Testing Co., Ltd. has partnered with Shanghai Hepingtouge Semiconductor Technology Co., Ltd. so far on its interactive platform.
Guangdong Leadyo IC Testing Co.,Ltd.(688135.SH) plans to use a maximum amount of no more than 0.2 billion yuan in temporarily idle funds raised for cash management.
Guangdong Leadyo IC Testing Co., Ltd. announced on July 24th that while ensuring the safety of raised funds and investment project funds, the company plans to use temporarily idle raised funds up to RMB 200 million (including principal) for cash management. Within the above-mentioned scope, the funds can be used in a rolling manner, and the usage period shall not exceed 12 months from the date of approval by the board of directors.
Guangdong Leadyo IC Testing Co., Ltd. (688135.SH): Its subsidiary has initially invested in the research and development of chips related to single-axis multi-spectral image sensor automatic driving.
On July 22nd, Guandong Leadyo IC Testing Co., Ltd. (688135.SH) stated on the interactive platform that the company's Advanced Technology Research Institute maintains reserves of advanced market chip testing technology in frontier chip fields such as Chiplet, SIP, sensor, storage, high computing power, AI, big data, Beidou navigation, vehicle chips, and self-driving car applications; increasing the production of intelligent cockpit and assisted driving; and the subsidiary, Shanghai Light Tongxin Microelectronics Co., Ltd., has made initial investments in research and development related to single-axis multi-spectral image sensor self-driving related chips, progress of which can be
Guangdong Leadyo IC Testing Co., Ltd. (688135.SH): The 'Leadyo convertible bond' will be listed for trade starting on July 19th.
Guangdong Leadyo IC Testing Co., Ltd. (688135.SH) announced that the company's issued 0.52 billion yuan convertible corporate bonds will be listed on the (stock) exchange on April 20, 2021. The bonds will be tradable in the bond market with the abbreviation CSI Enterprise Bond Index.
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