688260 Suzhou Gyz Electronic Technology

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13.56
+0.11+0.82%

Noon Break Jan 9 11:29 CST

1.63BMarket Cap-11.51P/E (TTM)

About Suzhou Gyz Electronic Technology Company

The company was founded in 2013 and is a high-tech enterprise focusing on core technology research and development in the fields of consumer electronics, automotive electronics and electronic ceramics. The company successfully landed on the Science and Technology Innovation Board of the Shanghai Stock Exchange on April 6, 2021, and is headquartered in Kunshan City, Jiangsu Province. The company is mainly engaged in R&D, design, manufacturing and sales of precision components in the field of optics and products in the fields of automotive electronics and electronic ceramics. The company's main products and services include precision electronic components, molds and electroplating processing, automotive electronic components, electronic ceramics, etc. The company has obtained honorary qualifications such as “High-tech Enterprise” and “Jiangsu Private Technology Enterprise”.

Company Profile

Short Name-A昀冢科技

Company NameSuzhou Gyz Electronic Technology Co., Ltd.

Listing DateApr 6, 2021

Issue Price9.63

Shares Offered30.00M share(s)

FoundedDec 4, 2013

Chairmanbin wang

Legal Representativebin wang

General Managerbin wang

Secretaryyan chen

Employees1078

ProvinceJiang Su Sheng

Phone0512-36831116

Office AddressNo. 269, Songjiagang Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province

Zip Code215300

Registered AddressNo. 269, Songjiagang Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province

Fax0512-36831116

EmailIR@gyzet.com

Websitehttps://www.gyz.com/

Business License91320583085045936C

BusinessThe company is an industry-leading private independent brand enterprise specializing in R&D, production and sales of precision electronic components in CCM camera optical modules and VCM voice coil motors. The company is supported by independent mold development and ultra-precision processing, and relies on advanced processes such as stamping, electroplating, injection molding, SMT, chip packaging testing, and assembly, as well as supporting automation equipment development capabilities and product innovation capabilities.