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Novoray Corporation: Spherical Titanium Oxide and other products are now being supplied in bulk. The market for more high-value filler products is being opened up | Direct report from the Earnings Conference.
① The company stated that since the beginning of the year, the sales of filler products used in the thermal interface field have been gradually increasing, and the capacity utilization rate of spherical products has further improved. In the fourth quarter, the company's operational status has been stable, meeting the company's development expectations; ② In addition to silicon aluminum oxide products, a series of high-end applications such as spherical Titanium and liquid fillers used in high dielectric high-frequency substrates have passed certification from domestic and international customers and have been shipped in bulk.
Are Strong Financial Prospects The Force That Is Driving The Momentum In Novoray Corporation's SHSE:688300) Stock?
We Think Novoray (SHSE:688300) Can Manage Its Debt With Ease
Multiple countries are increasing support for the semiconductor industry, and sector performance may gradually improve quarter by quarter.
Recently, multiple countries are increasing their support for the development of the semiconductor industry. On November 29, the German government is preparing to provide billions of euros in new investment to the country's semiconductor industry. On November 27, in order to support the development of the semiconductor industry, the South Korean Ministry of Finance announced plans to introduce 14 trillion Korean won (approximately 72.8 billion yuan) in low-interest loans next year.
Novoray Corporation (688300.SH): The company's products can be used in ai chip packaging materials.
On November 27, Gelonghui reported that novoray corporation (688300.SH) stated on an interactive platform that the current mainstream packaging technologies globally are mainly CSP and BGA. In the field of AI, chips need to have high-performance computing capabilities and often use advanced packaging forms that are high-performance and high-density, such as system-in-package (SIP), three-dimensional packaging (3D), and fan-out wafer-level packaging (FOWLP). These technologies have higher requirements for packaging processes and materials. For packaging fillers, in addition to having ultra-fine particle sizes, low CUT points, and high thermal conductivity, they must also possess high purity and safety among other requirements.
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