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Novoray Corporation (688300.SH): The company's products can be used in ai chip packaging materials.
On November 27, Gelonghui reported that novoray corporation (688300.SH) stated on an interactive platform that the current mainstream packaging technologies globally are mainly CSP and BGA. In the field of AI, chips need to have high-performance computing capabilities and often use advanced packaging forms that are high-performance and high-density, such as system-in-package (SIP), three-dimensional packaging (3D), and fan-out wafer-level packaging (FOWLP). These technologies have higher requirements for packaging processes and materials. For packaging fillers, in addition to having ultra-fine particle sizes, low CUT points, and high thermal conductivity, they must also possess high purity and safety among other requirements.
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novoray corporation (688300.SH): indirect customers are integrated circuit packaging and testing manufacturers
GMC November 11th | novoray corporation (688300.SH) stated on the interactive platform that the entire integrated circuit industry chain includes chip design, manufacturing, packaging, and testing, ultimately delivering the manufactured chips to end customers. The company's products belong to the upstream materials of the integrated circuit packaging process, with direct customers in the fields of epoxy molding compound (EMC), liquid molding compound (LMC), granular molding compound (GMC), underfill materials, and electronic circuit copper clad laminates (CCL) manufacturers, with indirect customers being integrated circuit packaging and testing manufacturers. nvidia
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