About Hefei Chipmore Technology Company

The company is a high-end advanced integrated circuit packaging testing service provider. It can provide customers with a full range of integrated circuit packaging and testing services, covering various types of products such as display driver chips, power management chips, and RF front-end chips. With years of hard work in the integrated circuit advanced packaging industry, the company has accumulated rich experience in advanced packaging technology with bump manufacturing (Bumping) and crystal coating (FC) as the core, and has formed a good pattern where the packaging and testing business of non-display chips such as power management chips and RF front-end chips go hand in hand. Since its establishment, the company has been engaged in advanced packaging and testing services for integrated circuits. The company's main products are display driver chip sealing and testing, and non-display chip sealing and testing. The company has successively been awarded honorary titles such as “Jiangsu Crystal Coating Engineering Technology Research Center”, “Jiangsu Intelligent Manufacturing Demonstration Workshop”, and “Provincial Enterprise Technology Center”. In 2023, the company continued to deepen R&D innovation, consolidate market advantages in segmented fields, and steadily increase production capacity. Its subsidiary Suzhou Qizhong won honorary titles such as “Jiangsu Provincial Enterprise Technology R&D Institution”.