About Forehope Electronic Company

The company was listed on the Science and Technology Innovation Board of the Shanghai Stock Exchange in November 2022. The company was founded in November 2017 and is mainly engaged in the development of integrated circuit packaging and test solutions, and the packaging processing and testing of various types of integrated circuit chips. The company is mainly engaged in integrated circuit packaging and testing business, provides integrated circuit packaging and testing solutions for integrated circuit design companies, and charges processing fees for packaging and testing services. The company's products mainly include “high-density fine-pitch convex inverted products (FC products), system-level packaging products (SiP), wafer-level packaging products (Bumping and WLP), flat leadless packaging products (QFN/DFN), and microelectromechanical system sensors (MEMS)”. Corporate honors: National High-tech Enterprise, selected in the fourth batch of “Major Integrated Circuit Project Enterprises List” in 2020, and has been awarded “Zhejiang Province's Top 100 Electronic Information Enterprises with Growth Characteristics”, “Zhejiang Top 100 Creative Enterprises”, “Zhejiang Shangyun Benchmark Enterprise”, “Ningbo's Top Ten Digital Economy Enterprises”, “Yuyao Municipal People's Government Quality Award” “2022 Ningbo Top 100 Enterprises with Management Innovation and Enhancement”, “Zhejiang High-tech Enterprise” The “Research and Development Center” and the “2.5 billion block high density integrated circuit and module packaging project for communication with an annual output of 2.5 billion blocks” were rated as major projects in Zhejiang Province.