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A Piece Of The Puzzle Missing From Guangdong Jiayuan Technology Co.,Ltd.'s (SHSE:688388) 28% Share Price Climb
Strong Week for Guangdong Jiayuan TechnologyLtd (SHSE:688388) Shareholders Doesn't Alleviate Pain of Three-year Loss
Guangdong Jiayuan Technology (688388.SH) has newly recognized Wen Bingtai as a core technical personnel.
Guangdong Jiayuan Technology (688388.SH) announced that the company's core technical staff member, Liu Xiaoyan, has applied to resign from the company for personal reasons...
Guangdong Jiayuan Technology (688388.SH): has already carried out relevant research and sample sending work for the new type of cathode current collector products required for solid state batteries.
Guangdong Jiayuan Technology (688388.SH) stated on the interactive platform on November 27 that Guangdong Jiayuan Technology always pays attention to the development changes in battery technology routes, and has currently started research and sample work on new type of cathode current collector products needed for solid state batteries.
Guangdong Jiayuan Technology (688388.SH): Ultra-thin UTF copper foil can be applied in the chip field.
On November 27th, Gelonghui reported that Guangdong Jiayuan Technology (688388.SH) stated on the interactive platform that the very low-profile HVLP copper foil is mainly used in high-frequency and high-speed circuit boards, while the ultra-thin UTF copper foil can be applied in the chip field. In recent years, the company has strengthened its layout in the high-end electronic circuit copper foil sector, promoting the domestic substitution process of high-end electronic circuit copper foil, and has achieved technological breakthroughs in high-end electronic circuit copper foils such as high-grade RTF copper foil, HTE copper foil, ultra-thin IC packaging copper foil, HVLP copper foil, and HDI copper foil.
Guangdong Jiayuan Technology (688388.SH): The research and development process of ultra-thin copper foil for IC packaging has progressed from the production of laboratory sheet samples to the production of roll samples.
Guangdong Jiayuan Technology (688388.SH) stated on the interactive platform on November 27 that the IC packaging ultra-thin copper foil is a special material used for electronic and flexible electronic products. It is the substrate for chip packaging (IC carrier board, similar carrier board), and HDI high-density interconnect board, which will benefit from the advancement of chip manufacturing processes. Currently, our company's research and development process of IC packaging ultra-thin copper foil has progressed from laboratory sheet samples production to roll samples production.