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688419 Nextool Technology

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  • 28.25
  • -1.64-5.49%
Market Closed Jul 23 15:00 CST
2.32BMarket Cap40.13P/E (TTM)

About Nextool Technology Company

The company sells semiconductor packaging equipment and molds to many well-known enterprises in the domestic semiconductor industry, and is one of the few domestic brand suppliers of semiconductor packaging equipment and molds. The company is mainly engaged in R&D, production and sales of intelligent manufacturing equipment used in the fields of semiconductor packaging and plastic extrusion molding, providing customers with customized intelligent manufacturing equipment and system solutions. The company's main products are semiconductor packaging equipment and molds, plastic extrusion molds, extrusion molding devices and downstream equipment. The company is a national high-tech enterprise, an innovative enterprise in Anhui Province, a specialized and new small and medium-sized enterprise in Anhui Province. It has an enterprise technology center certified by Anhui Province, and has established a postdoctoral research workstation.

Company Profile

Short Name-A耐科装备
Company NameNextool Technology Co., Ltd.
Listing DateNov 7, 2022
Issue Price37.85
Shares Offered20.50M share(s)
FoundedOct 8, 2005
Chairmanmingjiu huang
Legal Representativemingjiu huang
General Managertianqin zheng
Secretaryrong huang
Employees477
ProvinceAn Hui Sheng
Phone0562-2108768
Office AddressNo. 2888, Tianmenshan North Road, Tongling Economic and Technological Development Zone, Anhui
Zip Code244061
Registered AddressWithin Tongling Economic and Technological Development Zone, Anhui
Fax0562-2108779
Emailir@nextooling.com
Business License913407007810593387
BusinessThe issuer is mainly engaged in R&D, production and sales of intelligent manufacturing equipment applied to the fields of plastic extrusion molding and semiconductor packaging, and provides customers with customized intelligent manufacturing equipment and system solutions. The main products are plastic extrusion molding molds and downstream equipment, semiconductor packaging equipment and molds.

Company Executives

  • Name
  • Position
  • Salary
  • mingjiu huang
  • Chairman, Directors, Core Technical Personnel
  • 804.80K
  • xianglong fu
  • Directors
  • --
  • chengsheng wu
  • Directors, Deputy General Manager, Core Technical Personnel, Chief Engineer
  • 670.50K
  • huogen hu
  • Directors, Deputy General Manager, Core Technical Personnel
  • 670.50K
  • tianqin zheng
  • Directors, General Manager, Core Technical Personnel
  • 770.50K
  • yunsong ruan
  • Directors
  • --
  • ting li
  • Independent Directors, Audit Committee Member, Member of the Strategy Committee, Nomination Committee Members
  • --
  • lamei mao
  • Independent Directors
  • 60.00K
  • xianguo hu
  • Independent Directors
  • 60.00K
  • rong huang
  • Board Secretary
  • 497.60K
  • xiao fu
  • Chairman of the Supervisory Board, Core Technical Personnel, Employee Representative Supervisor
  • 279.90K
  • yingbao cui
  • Auditors
  • --
  • hong jiang
  • Auditors
  • --
  • jinfeng xu
  • Deputy General Manager
  • 670.50K
  • chuanwei wang
  • Chief Financial Officer
  • 497.60K
  • haojia he
  • Core Technical Personnel
  • 153.00K
  • tangli fang
  • Core Technical Personnel
  • 320.80K
  • xiangguo wang
  • Core Technical Personnel
  • 132.40K

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