The company was founded in March 2018 and is headquartered in Shaoxing, Zhejiang. It is a manufacturer focusing on power, sensing and transmission applications, providing foundry services for analog chip and module packaging. The company uses foundry as a starting point and extends downward to module packaging to provide domestic and foreign customers with one-stop foundry solutions, provide a complete manufacturing platform for semiconductor product companies in the fields of power, sensing and transmission, and support customer R&D and large-scale mass production. The company has established four major technical directions of power, MEMS, BCD, and MCU, and continues to develop advanced processes and technologies for products required in industrial control fields and high-end consumer fields such as new energy vehicles, wind and solar storage, power grids, and data centers. The company's product direction mainly includes IGBTs, MOSFETs, SiCMOSFETs, BCD-based power semiconductors, MEMS-based sensing signal chains, and power-related module packaging.