Established in 2011, the company is a design company that provides RF front-end chips for smart phones, the Internet of Things, etc., and its main business is R&D, design and sales of RF front-end chips and modules. The company has a full range of RF front-end chip design capabilities and integrated module research and development capabilities. The technical system is centered on power amplifier (PA) design capabilities, and also has the ability to design RF devices such as low noise amplifiers (LNAs), radio frequency switches (Switches), and integrated passive device filters (IPDfilters). The main business is R&D, design and sales of RF front-end chips and modules. The company's main products are L-PAMIF transmission modules, L-FEM receiving modules, 5g mmMBPA modules and L-PAMID modules, MMMBPA modules, 4G LTE reconfigurable RF front-end products, 4G multi-frequency multi-mode power amplifier modules (MMMBPAM), and a series of high-performance, low-power Wi-FiFEM products. Corporate honors: It won the first prize of the China Communications Society Science and Technology Award, the 4G reconfigurable RF front-end chip kit S5643-51 product independently developed by the company won the 14th “China Chip” Outstanding Market Performance Product Award, and the SOI Product Alliance's “SOI Industry Achievement Award”.
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