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Huahai Chengke (688535.SH): Electronic adhesives can be used for PCB board-level assembly.
On July 23, Gelunhui reported that Huahaicheng Technology (688535.SH) recently stated during a visit to institutional investors that the company's product -- electronic adhesives -- can be used for PCB board-level assembly. The company has not partnered with Shennan Circuits and Wu's Printed Circuit.
Huahai Chengke (688535.SH): The independently developed gmc manufacturing special equipment has the ability to mass produce and is continuously optimized.
Huahai Chengke (688535.SH) recently stated during its reception of institutional investors that in the advanced packaging field, gmc products have been approved by multiple clients. The self-developed special equipment for gmc manufacturing is already capable of mass production and continuously optimized.
Huahai Chengke (688535.SH): Granular epoxy encapsulant (GMC) can be used for HBM packaging.
Huahai Chengke (688535.SH) recently stated during a visit with institutional investors that the company's granular epoxy encapsulant (GMC) can be used for HBM packaging. The related products have passed customer validation and are now in the sample stage.
Huahai Chengke (688535.SH): Its main products include epoxy potting materials and electronic adhesives.
Huahai Chengke (688535.SH) recently stated during a visit to institutional investors that the company's main products include epoxy encapsulating materials and electronic adhesives, which are widely used in semiconductor packaging, board-level assembly and other applications. Epoxy molding materials are also used in the packaging of static random access memory chips and high-bandwidth memory chips.
Jiangsu HHCK Advanced Materials Co.,Ltd's (SHSE:688535) Market Cap Rose CN¥373m Last Week; Retail Investors Who Hold 35% Profited and so Did Insiders
Ping An Securities: High-bandwidth characteristics unleash the performance of AI hardware. The continued prosperity of AI drives high demand for growth.
With the current sustained prosperity of AI computing power, HBM, as an important memory technology for AI hardware and systems to enhance computing performance, has shown strong growth in market demand.
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