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Jiangsu Huahai Chengke New Materials Co., Ltd. 2024 semi-annual report
Jiangsu Huahai Chengke New Materials Co., Ltd. Summary of 2024 Interim Report
The utilization rate of downstream customers' production capacity has increased, and Huahai Chengke's net profit in the first half of the year has more than doubled. High-end packaging materials have not yet achieved mass production.
① The company's GMC can be used for HBM packaging. The related products have been validated by customers and are now in the sampling phase. ② The company's capacitor materials have been widely applied, and materials for photovoltaic module packaging have generated a small amount of sales. The release of mold-release materials and mold-release agents for semiconductor packaging is expected to begin in the third quarter.
Huahai Chengke (688535.SH): The net income for the first half of the year was 24.8944 million yuan, a year-on-year increase of 105.87%.
On August 21st, Huahai Chengke (688535.SH) released its semi-annual report. During the reporting period, the company achieved revenue of 155.3195 million yuan, a year-on-year increase of 23.03%; achieved a total profit of 27.684 million yuan, a year-on-year increase of 122.68%; achieved a net profit attributable to the owners of the parent company of 24.8944 million yuan, a year-on-year increase of 105.87%. It is planned to distribute a cash dividend of 1.00 yuan per 10 shares to all shareholders. During the reporting period, the company continued to increase its investment in research and development, benchmarking the application needs of advanced packaging materials in the field of advanced packaging, with the help of raised funds and its own
Huahai Chengke (688535.SH): Products with a 12um break and products under development with 8um and 5um breaks can be used for MR-MUF processes.
On August 13th, Gelunhui reported that Huahaicheng Technology (688535.SH) stated on the investor interaction platform that our 12um card cutting products and the currently under development 8um and 5um card cutting products can be used in the MR-MUF process.
Hua Hai Cheng Ke (688535.SH): Conventional products and sulfur-free EMC can be used for the encapsulation of automotive electronics.
On August 13th, GeLongHui reported that Huahai Chengke (688535.SH) stated on the investor interaction platform that the company's regular products and sulfur-free EMC can be used for the packaging of automotive electronics. The company had already laid out the automotive electronics industry several years ago, and several products have achieved bulk sales.
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