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Qingdao Gaoce Technology (688556.SH): Launched a 21μm linear tungsten wire diamond wire using cold drawing process to the market since June this year.
Qingdao Gaoce Technology (688556.SH) stated on the investor interaction platform on September 11 that the company has launched the cold drawing process 21μm wire-cut tungsten wire, which has obvious advantages in leading technology. It has been widely used in various slicing bases of the company and is currently being tested by some customers for promotion.
2024 Semi-Annual Report
2024 Semi-Annual Report Summary
Qingdao Gaoce Technology (688556.SH) released its performance for the first half of the year, with a net income of 0.273 billion yuan, a year-on-year decrease of 61.8%.
Qingdao Gaoce Technology (688556.SH) released its 2024 interim report, with a revenue of 2.646 billion yuan...
Qingdao Gaoce Technology (688556.SH): The net income in the first half of the year was 0.273 billion yuan, a year-on-year decrease of 61.80%. Proposed dividend of 3.8 yuan per share.
Qingdao Gaoce Technology (688556.SH) announced its semi-annual report for the first half of 2024, achieving revenue of 2.646 billion yuan, a year-on-year increase of 4.96%; net income attributable to shareholders of the listed company of 0.273 billion yuan, a year-on-year decrease of 61.80%; net income attributable to shareholders of the listed company excluding non-recurring gains and losses of 0.238 billion yuan, a year-on-year decrease of 65.67%; basic earnings per share of 0.5 yuan. The company plans to distribute a cash dividend of 3.80 yuan (including tax) per 10 shares to all shareholders. During the reporting period, the company's revenue increased by 4.96% compared to the previous period.
Qingdao Gaoce Technology (688556.SH): The 6-inch and 8-inch silicon carbide wire saw machines launched have generated batch orders and achieved large-scale delivery.
On August 21st, Gelonhui reported that Qingdao Gaoce Technology (stock code: 688556.SH) is focusing on the research and development of cutting-edge hard and brittle materials. The company is fully leveraging the fusion development and technological closed-loop advantages of "cutting equipment + cutting consumables + cutting process", and continuously promoting the industrial application of diamond wire cutting technology in more fields such as photovoltaic silicon materials, semiconductor silicon materials, sapphire materials, magnetic materials and silicon carbide materials. In the field of semiconductor silicon materials, the company's semiconductor dicing machine and 6-inch and 8-inch semiconductor diamond wire slicers have formed batch orders, which can achieve semiconductor wafer 6-inch and 8-inch.
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