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2024 Third Quarter Report
Tiansheng Technology (688603.SH): Currently, the main products can cover the field of optical chips.
Gelonghui on October 22nd | Tiancheng Technology (688603.SH) stated on the investor interaction platform that the company's main products currently cover the optical chip field, mainly used in compound semiconductor production and packaging processes, including processes such as gold plating, copper plating, nickel plating, tin-silver alloy plating, etc. The company is also actively developing more related products to provide various functional wet electronic chemical materials support for the optical chip industry.
Tiansheng Technology (688603.SH): The company is currently undergoing continuous testing and verification with more than a dozen downstream customers.
Gelonghui October 17th | Tiancheng Technology (688603.SH) Investor Relations Activity Record shows that the company is currently undergoing continuous testing and verification with more than a dozen downstream customers, and has already achieved small-batch product sales, actively collaborating with equipment manufacturers and customers to promote the maturity and implementation of related technologies. Compared to TGV, TSV typically has a smaller opening diameter, a larger aspect ratio, and the need to address the liquid exchange at the bottom of the silicon via. The difficulty of filling hole electroplating in TGV lies in how to quickly establish connections in the middle of the via and improve the efficiency of the electroplating process.
Tiancheng Technology (688603.SH): The company aims to achieve a domestic market share of over 30% from advanced packaging to wafer manufacturing electroplating additives within the next 3 years.
The investor relations activity record of Tiancheng Technology (688603.SH) on October 17th showed that the company is committed to becoming the main supplier of major international and domestic mainstream packaging and testing customers in the next 2 years. The company aims to achieve a domestic market share of over 30% from advanced packaging to wafer manufacturing electroplating additives within 3 years.
