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Tiancheng Technology (688603.SH) plans to establish a holding subsidiary with Pu Chen Fund by jointly investing 0.112 billion.
On January 10, Gelonghui reported that Tiancheng Technology (688603.SH) announced that based on the overall Global Strategy of the company, in order to better carry out the Business of integrated circuits, improve overall competitiveness and accelerate integration into Shanghai's integrated circuit industry, the company plans to jointly invest 112 million yuan with Puchen Fund to establish a holding subsidiary in Zhangjiang, Shanghai. Through this holding subsidiary, the company aims to create the integrated circuit division of Tiancheng Technology, starting with existing integrated circuits, advanced packaging, and Glass wafer plating solution products, continuously researching, developing, and applying key technologies, cutting-edge technologies, and related core materials in the field of integrated circuits for the integrated circuit industry.
Tian Cheng Technology (688603.SH) plans to issue 4.5 new shares for every 10 shares in the first three quarters, with ex-rights and ex-dividend on January 6.
Tiancheng Technology (688603.SH) announced that in the first three quarters of 2024, the company plans to use capital surplus to distribute to all Shareholders...
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2024 Third Quarter Report
Tiansheng Technology (688603.SH): Currently, the main products can cover the field of optical chips.
Gelonghui on October 22nd | Tiancheng Technology (688603.SH) stated on the investor interaction platform that the company's main products currently cover the optical chip field, mainly used in compound semiconductor production and packaging processes, including processes such as gold plating, copper plating, nickel plating, tin-silver alloy plating, etc. The company is also actively developing more related products to provide various functional wet electronic chemical materials support for the optical chip industry.
