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Jingzhida (688627.SH): is actively laying out the test equipment for semiconductor memory products that can be used in advanced packaging technology.
Jingzhida (688627.SH) stated on the interactive platform on September 6th that hybrid bonding is an advanced semiconductor packaging technology. The company is currently actively deploying testing equipment for semiconductor memory products that can be used with advanced packaging technology.
Jingzhida (688627.SH): has repurchased 0.98% of the shares.
On September 3, Gelonghui announced that as of August 31, 2024, the company has repurchased a total of 0.925 million shares through the Shanghai Stock Exchange trading system using the centralized bidding trading method, accounting for 0.98% of the total share capital of the company. This represents a 0.44% increase compared to the previous disclosure. The highest price at which the repurchases were made was RMB 64.26 per share, and the lowest price was RMB 37.93 per share. The total amount paid for the repurchases was RMB 41.091696 million (excluding stamp duty, transaction commissions, and other transaction costs).
Shenzhen SEICHI Technologies (SHSE:688627) Is Posting Solid Earnings, But It Is Not All Good News
2024 Semi-Annual Report
2024 Semi-Annual Report Summary
Jingzhida (688627.SH): The net income after deducting non-recurring gains and losses in the first half of the year was 31.0376 million yuan, a year-on-year increase of 45.34%.
Gelonghui announced its semi-annual report on August 26. During the reporting period, the company achieved revenue of 361.6045 million yuan, a year-on-year increase of 46.15%; the net profit attributable to the shareholders of the listed company after deducting non-recurring gains and losses was 31.0376 million yuan, a year-on-year increase of 45.34%. The overall scale of operation and level of profitability maintained a high-quality growth trend. During the reporting period, in the field of new display device testing equipment, the company has completed the technical iteration and product upgrade of the Cell and Module related testing equipment for the G8.6AMOLED production line.
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