The 2024 World Consumer Electronics Fair is about to open, and the smart phone market is expected to grow against the trend.

①The 2024 World Consumer Electronics Exhibition will be held at the Shenzhen Convention and Exhibition Center from November 28th to 30th, 2024. ②China Merchants Securities believes that the Android flagship phones have entered an intensive release stage, with Xiaomi, OPPO, vivo, Honor, and Huawei all having released flagship new phones in this round, all highlighting AI and optical features. Pay attention to the innovation of new phones and subsequent sales.

cls.cnNov 27 19:03 ET

Bomin Electronics: Bomin Jiangsu's production capacity utilization rate is about 90%, and the first phase of the investment project is expected to start trial operation at the end of the year | Direct hit on earnings conference

bomin electronics stated that the new generation of electronic information industry investment expansion project (Phase I) 3# plant has been basically completed, and if there are no other factors interfering, it is expected that some processes will enter the trial operation state by the end of the year. bomin electronics chairman and general manager Xu Huan stated that the comprehensive production capacity utilization rate of Jiangsu bomin is around 90% currently, showing an upward trend following the industry's recovery.

cls.cnNov 18 09:22 ET

Tianma Microelectronics' MicroLED production line will be fully integrated by the end of the year! Several projects will enter mass production in 2025, with automotive scenarios becoming the next focus.

1. Multiple manufacturers have announced progress in MicroLED production lines, with 2025 being the first production year for multiple manufacturers. 2. Analysis shows that in scenarios such as automotive and AR, MicroLED is irreplaceable. 3. The industry believes that there are still difficulties in the large-scale application of MicroLED.

cls.cnNov 8 08:25 ET

taiwan semiconductor's CoWoS packaging capacity is in short supply, and the advanced packaging industry remains highly prosperous.

taiwan semiconductor has obtained nvidia's consent to increase prices next year, with the possibility of a maximum 5% price increase for the 3nm process and a price increase of approximately 10% to 20% for CoWoS packaging. citic sec believes that advanced packaging technology has become an important path beyond the 'post-Moore era' and 'Moore's Law'. Focus on manufacturers and assembly and testing companies deploying advanced packaging technology, as well as supply chain related equipment manufacturers.

cls.cnNov 6 18:55 ET

Leading explosive financial report confirms the hot demand for HBM, which semiconductor companies in A-shares are likely to benefit?

①sk hynix announced its third-quarter performance, with HBM sales up more than 330% year-on-year; ② Bank of America Merrill Lynch predicts that sk hynix's HBM sales in the next two years will reach $9.2 billion and $15.8 billion; ③ brokerage point of view, it is recommended to focus on new materials related to AI investment main line under computing power, storage, and advanced packaging.

cls.cnOct 23 23:19 ET

Share buyback shareholding loans quickly landed! ICBC, BOC, ABC, CMB, CITIC and other first batch of multiple banks announced progress. Some banks have already shown cooperation intentions with nearly a hundred listed companies.

1. As of now, Bank of China has reached cooperation intentions with nearly a hundred listed companies, with 32 listed companies explicitly promised loans, covering multiple industries such as integrated circuits, transportation, high-end manufacturing, and business services; 2. The banks stated that they will strictly adhere to the risk compliance bottom line, rigorously prevent crediting funds that do not meet the conditions of stock increase stake & buyback and refinancing policies from illegally flowing into the stock market.

cls.cnOct 21 03:54 ET