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The new optoelectronic co-packaging technology may replace electrical interconnect devices in Datacenters, significantly enhancing the speed and energy efficiency of AI and Other computing applications. Peking, December 12, 2024 /PR Newswire/ -- Recently, IBM (NYSE: IBM) announced its groundbreaking research results in optical technology, which are expected to substantially improve the efficiency of training and running generative AI models in Datacenters. The new generation optoelectronic co-packaging (co-packaged optics, CPO) process developed by IBM researchers achieves optical technology within the Datacenter.
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