Globetronics Technology Bhd  has announced a strategic partnership with Taiwan based semiconductor company ChipMOS Technologies Inc. where it will provide cutting-edge dicing, packaging, and testing services for integrated circuit products delivered by the Taiwan company.

The agreement is for ChipMOS, as the supplier of these products, to be responsible for furnishing GTB with the necessary wafers, detailed specifications, and production forecasts to facilitate efficient processing. The parties said the partnership is expected to strengthen both companies' capabilities in semiconductor backend services, enabling the delivery of high-quality solutions to meet the growing demands of the global market.

This collaboration will leverage the strengths of both GTB's advanced packaging and testing expertise and ChipMOS's market leadership in integrated circuit manufacturing. The agreement also outlines a commitment to rigorous quality control, efficient processing methods, and flexibility to meet evolving market demands and customer requirements

The partnership will see a total estimated contract value of minimum of RM145 million is for a three-year agreement.

The partnership, GTB said is expected to contribute significantly to the semiconductor ecosystem by integrating innovative solutions and optimising operational efficiencies.