share_log

ACM Research Announces The Qualification Of Its Ultra Fn A Plasma-Enhanced Atomic Layer Deposition (PEALD) Furnace Tool

ACMリサーチは、超FN Aプラズマ強化原子層堆積(PEALD)炉の資格を発表しました。

Benzinga ·  2024/12/11 05:15

ACM Research, Inc. ("ACM") (NASDAQ:ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced packaging applications, today announced the qualification of its Ultra Fn A Plasma-Enhanced Atomic Layer Deposition (PEALD) Furnace tool. The tool has achieved process qualification at a mainland China semiconductor customer, and is now entering mass production. ACM also announced that its Ultra Fn A Thermal Atomic Layer Deposition (Thermal ALD) Furnace tool, introduced in 2022, has successfully completed process qualification with another leading mainland China customer, demonstrating performance parameters that it believes match or exceed competitive tools.

これらの内容は、情報提供及び投資家教育のためのものであり、いかなる個別株や投資方法を推奨するものではありません。 更に詳しい情報
    コメントする