Tongfu MicroelectronicsLtd (SZSE:002156) Stock Performs Better Than Its Underlying Earnings Growth Over Last Five Years
When you buy a stock there is always a possibility that it could drop 100%. But when you pick a company that is really flourishing, you can make more than 100%. Long term Tongfu Microelectronics Co.
TongFu Microelectronics: 2024 Interim Performance Forecast
Tongfu Microelectronics (002156.SZ): Actively carries out domestic and foreign patent layout in multiple advanced packaging technology fields.
On July 8, GraceLink reported that Tongfu Microelectronics (002156.SZ) stated on its investor interaction platform that the company has continuously strengthened independent innovation during its development, and has actively carried out domestic and international patent layouts in multiple advanced packaging technology fields. As of December 31, 2023, the company has accumulated 1,544 domestic and foreign patent applications, with advanced packaging technology layout accounting for more than 60%.
Tongfu Microelectronics (002156.SZ): through acquisition, has formed a powerful joint venture and cooperation model with AMD.
On July 8th, GeLongHui reported that an investor asked Tongfu Microelectronics (002156.SZ) on the investor interaction platform: "Does your company have any cooperation with AMD?" The company replied that through mergers and acquisitions, they have formed a strong alliance model of "joint venture + cooperation" with AMD, established a strategic partnership and signed a long-term business agreement.
Tongfu Microelectronics Agrees to Joint Investment With CITIC Construction Investment
Tongfu Microelectronics (SHE:002156) agreed to jointly invest with CITIC Construction Investment in Xiamen Runxin Huize Investment Partnership. The partnership's total subscribed capital was 180.8 mil
Tongfu Microelectronics (002156.SZ) intends to jointly invest in a partnership enterprise with professional investment institutions.
On July 3rd, Gelunhui reported that Tongfu Microelectronics (002156.SZ) recently signed a partnership agreement with China Securities Co., Ltd. and China Securities Investment Co., Ltd. to jointly invest in Xiamen Runxin Huize Investment Partnership Enterprise (Limited Partnership). The total subscribed capital of the partnership enterprise is 180.81 million yuan. The company, as a limited partner, subscribed 100.45 million yuan with its own funds, accounting for 55.56% of the total subscribed capital of the partnership enterprise. Investment direction of the fund: carry out private equity investment, and directly or indirectly invest in the equity of semiconductor industry companies through special purpose vehicles.
Benign Growth For Tongfu Microelectronics Co.,Ltd (SZSE:002156) Underpins Its Share Price
With a price-to-sales (or "P/S") ratio of 1.6x Tongfu Microelectronics Co.,Ltd (SZSE:002156) may be sending very bullish signals at the moment, given that almost half of all the Semiconductor companie
Ping An Securities: Storage and calculation will still be the main focus of the semiconductor industry, bullish on domestic substitution space in the advanced packaging industry chain.
Advanced packaging is an important technological path to address the upgraded storage and computing demand. With the recovery of the semiconductor cycle, the bottom of the packaging and testing cycle has been solidified, and a new round of growth has begun in H1 2024.
Tongfu Microelectronics (002156.SZ): The first phase of employee stock ownership plan stocks have been sold out.
On June 19th, Geelong News reported that Tongfu Microelectronics (002156.SZ) announced that during the period from June 10, 2022 to June 19, 2024, after the expiration of each lock-up period of the first phase of employee shareholding plan, a total of 5,920,092 shares were sold through centralized bidding, accounting for 0.390% of the company's total share capital. All the held shares have been sold.
Tongfu Microelectronics (002156.SZ) plans to distribute 0.12 yuan per 10 shares on June 25 after ex-rights and ex-dividend.
Zhitong Finance APP news, Tongfu Microelectronics (002156.SZ) announced that the company's 2023 annual equity distribution plan: to distribute a cash dividend of 0.12 yuan (including tax) per 10 shares to all shareholders. The ex-dividend date is June 25, 2024.
[BT Financial Report Analysis] Tongfu Microelectronics Q1 2024 comprehensive analysis: steady performance growth, strong cash flow performance.
Tongfu Microelectronics (stock code: 002156) recently released its financial report for the first quarter of 2024. As a leading enterprise in integrated circuit packaging and testing services, its performance has been well received by the market. This article will provide a detailed and in-depth analysis and discussion of Tongfu Microelectronics' balance sheet data, profit data, and cash flow data. In terms of balance sheet, as of the end of the reporting period, Tongfu Microelectronics' total assets reached 35.021 billion yuan, a slight increase of 0.41% from the end of the previous year, maintaining a stable growth trend. The total liabilities amounted to 20.2 billion yuan, and the debt-to-asset ratio was 57.68%, slightly down from the initial 57.87%.
Tongfu Microelectronics (002156.SZ) is actively developing packaging technologies such as Chiplet and 2D+.
On June 13th, Gelonhui reported that Tongfu Microelectronics (002156.SZ) stated on the investor interaction platform that the company grasps the market development opportunities, focuses on future high value-added products and market hot spots, and takes a long-term perspective to vigorously develop packaging technologies such as fan-out, wafer-level, and inverted welding, and expand its production capacity. In addition, the company actively layouts Chiplet, 2D+ and other packaging technologies to form differentiated competitive advantages.
Tongfu Microelectronics (002156.SZ) has reserves of glass substrate packaging related technologies.
Tongfu Microelectronics (002156.SZ) stated on the investor interaction platform on June 13th that the company has technical reserves related to glass substrate packaging.
Tongfu Microelectronics (002156.SZ): Currently not involved in electromagnetic shielding technology and products.
On June 13th, Gelonhui reported that Tongfu Microelectronics (002156.SZ) stated on the investor interaction platform that the company is not currently involved in electromagnetic shielding technology and products.
Tongfu Microelectronics (002156.SZ) currently has no related business cooperation or contact with NVIDIA.
As of now, Tongfu Microelectronics (002156.SZ) has no relevant business cooperation or contact with Nvidia according to their investor communication platform.
Orient Securities: AI models on smartphones will become a trend. Generative AI is expected to reshape smart phones.
By 2024, the AI technology on mobile devices is expected to have a rapid development, making it possible to run local large models on mobile devices with the advancement of AI large model technology and the improvement of AI chip computing power for mobile phones.
BOCI International: Specialized storage stabilizes and rebounds, with AI-driven high-end demand accelerating volume growth.
Zhìtōng Cáijīng app learned that CCB International released research reports stating that as we step into 2024, the upward trend of DRAM and NAND prices will continue and the turning point for niche storage may have already arrived. Driven by the rising price trend for bulk products and the full fermentation of the benefits of reduced production by industry players, the inventory level of channel dealers has significantly decreased, and niche storage such as NOR Flash has begun to brew a price hike. Looking ahead for the whole year, along with the recovery trend of storage original manufacturers and the emergence of terminal innovations represented by AI phones and AIPCs, the storage sector's dual logic of "cycling + growth" is expected to continue resonating, and the large fund's third phase may further drive domestic storage, and the industry may face...
Tongfu Microelectronics Co.,Ltd (SZSE:002156) Surges 11%; Retail Investors Who Own 40% Shares Profited Along With Institutions
Key Insights The considerable ownership by retail investors in Tongfu MicroelectronicsLtd indicates that they collectively have a greater say in management and business strategy 51% of the business
Guojin Securities: 24 will be the first year of AI reasoning and will continue to be optimistic about HBM related industry chain companies
Guojin Securities released a research report saying that 23 will be the first year of AI training, and 24 will be the first year of AI reasoning. This is mainly due to the fact that overseas AI application products, including Sora, are expected to continue to be launched, superimposed on domestic central enterprises, and AI applications, which will strongly drive the demand for AI reasoning.
Tongfu Microelectronics (002156.SZ): The memory production line, which has been in place for many years, has steadily entered the mass production stage
Gelonghui, May 22丨Tongfu Microelectronics (002156.SZ) said on the investor interactive platform that in 2023, the company will continue to grow in the memory business. As memory chip technology becomes more mature, the company's long-standing memory production line has steadily entered the mass production stage and significantly increased the company's market share in related fields.
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