About COWELL Company

Our camera modules use “flip-chip” technology (semiconductor processor chips (generally referred to as chips) are directly attached to the substrate in an “inverted” manner) or “on-board chip” technology (using metal wire to directly mount the chip and electrically interconnect to the substrate). In 2013, it became the sixth largest supplier of camera modules in the world. With our experience and expertise in manufacturing camera modules based on COB technology, we began producing fixed focus camera modules using advanced flip chip technology in 2012.