About COWELL Company

Our camera modules use “flip-chip” technology (semiconductor processor chips (generally referred to as chips) are directly attached to the substrate in an “inverted” manner) or “on-board chip” technology (using metal wire to directly mount the chip and electrically interconnect to the substrate). In 2013, it became the sixth largest supplier of camera modules in the world. With our experience and expertise in manufacturing camera modules based on COB technology, we began using advanced flip chip technology to produce fixed focus camera modules in 2012.