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Soochow: AI-driven growth in cooling demand presents opportunities for related enterprises.
Soochow released a Research Report stating that as AI drives increased performance demands, thermal management has become a key foundation for performance enhancement. In the edge AI field, increased functionality and performance requirements have made thermal issues more prominent. Meanwhile, thermal management is a system engineering task that requires various thermal materials to work together across different stages. Related companies such as Lingyi Itech (002600.SZ), Jieban Technology (301326.SZ), Jones Tech Plc (300684.SZ), Siquan New Materials (301489.SZ), and Suzhou Tianmai (301626.SZ) are expected to benefit from the demand for thermal management.
Suzhou Tianmai (301626.SZ): In the field of liquid Metal cooling, it has developed and reserved products such as liquid Metal thermal paste and liquid Metal phase change thermal conductive sheets.
On January 14, Gelonghui reported that Suzhou Tianmai (301626.SZ) stated on the investor interaction platform that the company has developed products in the field of Liquid Metal cooling, including liquid metal thermal paste and liquid metal phase change thermal conductive sheets. The revenue from these products is currently low, so please be aware of investment risks.
Suzhou Tianmai (301626.SZ): Products are widely used in various types of 4G phones, 5G phones, laptops, tablets, and other Consumer Electronics terminals.
On December 24, Gelonghui reported that Suzhou Tianmai (301626.SZ) stated on the investor interaction platform that the company's products are widely used in various 4G phones, 5G phones, laptops, tablets, and other Consumer Electronics terminals; in the mid-to-high-end cooling markets for 5G base stations, Servers, optical communications, automotive electronics, and industrial control, the company relies on independent innovation to continuously enhance product competitiveness. The self-developed thermal interface materials, heat pipes, and temperature uniformity plate cooling modules are gradually replacing the products of Overseas manufacturers, further improving China's electronic cooling Industry Chain.
Suzhou Tianmai (301626.SZ): Currently, the production capacity of the main products can meet the supply needs.
On November 27, Gelonghui reported that Suzhou Tianmai (301626.SZ) stated on the investor interaction platform that the company focuses on the research, production, and sales of thermal conductive materials and components, adhering to the service principle of prioritizing customer satisfaction. The company has always been attentive to customer dynamics and market demands. The current production capacity of the company's main products can meet supply needs.
Suzhou Tianmai (301626.SZ): Relying on years of accumulation in the fields of heat pipes and temperature-regulating plates, quickly passed product certification from brand clients such as Samsung, OPPO, vivo, Huawei, and logitech international.
On November 26, Gu Longhui reported that Suzhou Tianmai (301626.SZ) announced that as consumer electronics continue to develop towards high performance, multi-functionality, and thinness, the internal heat generation and cooling requirements of consumer electronics such as smart phones, laptops, and smart projectors have significantly increased. Heat pipes and vapor chambers, due to their excellent thermal conductivity, are being increasingly adopted by many consumer electronics brands, leading to a rising penetration rate. The company relies on years of experience in the field of heat pipes and vapor chambers, as well as outstanding product performance and mass production capability, successfully passed the evaluations from Samsung, OPPO, within a short period.
Suzhou Tianmai (301626.SZ): The series of products successfully developed, such as high thermal conductivity, low volatility, low oil leakage thermal conductive silicone sheets, are widely used in the high-end product markets of consumer electronics and c
On November 26, Glonhui reported that Suzhou Tianmai (301626.SZ) was established in 2007. At the beginning, the company's main product was thermal interface materials. The mastery of its core technology relies on long-term R&D investment and technological accumulation, resulting in high technical barriers in the mid-to-high-end product field. The market has long been monopolized by European, American, and japanese manufacturers. Since its establishment, the company has continuously invested in technical forces for formulation research and process improvement in this field. After more than a decade of continuous development, thermal interface materials have become the company's competitive products. The company has successfully developed high thermal conductivity, low volatility, and low oil leaching thermal silicone sheets.