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China Wafer Level CSP (603005.SH): Shareholder, Zhongxin Chuangtou, plans to reduce their shareholding by no more than 2%.
China Wafer Level CSP (603005.SH) announced that a shareholder, Suzhou Industrial Park Creative Venture Investment Co., Ltd. (hereinafter referred to as "CICV"), plans to reduce its shareholdings by no more than 13,043,400 shares, or 2% of the total share capital of the company, through bulk trade from August 15, 2024 to November 14, 2024. (If there are changes in the number of shares due to stock dividends, capital reserve funds transfer, or other share changes during the share reduction plan implementation period, the number of shares to be reduced will be adjusted accordingly.)
China wafer level csp (603005.SH): The related products are currently widely used in smart phones, digital security monitoring and other IOT applications.
China Wafer Level CSP (603005.SH) said on its investor interactive platform that the company's packaged products include imaging sensor chips, biometric identification chips, MEMS chips, radio frequency chips, etc., and related products are widely used in smart phones, security monitoring digital products and other IoT, automotive electronics, medical and other terminal markets, including self-driving cars and other application areas. With the rapid development of new application markets such as self-driving and intelligent driving, the demand for sensor markets represented by imaging sensor chips will also show a rapid growth trend.
Midday A-share market report: the Shenzhen Component Index rose by 0.26%, with the consumer electronics and semiconductor sectors leading the gains.
As of midday closing, the Shanghai Composite Index fell 0.01% to 2922.27 points, the Shenzhen Component Index rose 0.26%, and the Chinext Price Index fell 0.13%.
China Wafer Level CSP's half-year performance forecast for 2024.
China Wafer Level CSP (603005.SH): It is expected that the net income for the first half of the year will increase by 40.97% to 52.72% year-on-year.
China Wafer Level CSP (603005.SH) announced that, according to the preliminary estimation by the company's financial department, it is expected to achieve a net income attributable to shareholders of the listed company of 108 million yuan to 117 million yuan in the first half of 2024, a year-on-year increase of 40.97% to 52.72% compared with the first half of 2023, a quarter-on-quarter increase of 46.97% to 59.22% compared with the second half of 2023. After deducting non-recurring gains and losses, it is expected that the net income attributable to shareholders of the listed company in the first half of 2024 will be about 87 million yuan to 97 million yuan, the same period as the first half of 2023.
China Wafer Level CSP (603005.SH) plans to set up a wholly-owned subsidiary in Malaysia with an investment of 50 million US dollars.
On June 27, Gelunhui reported that China Wafer Level CSP (603005.SH) intends to establish a wholly-owned subsidiary in Malaysia (hereinafter referred to as the "Malaysian subsidiary") through its Singapore subsidiary OPTIZ PIONEER in response to the development trend of the integrated circuit industry, promoting the company's market development, project expansion and global production. The aim is to build a company's overseas production base, enhance the company's production and manufacturing, and technology service capabilities, better serve the overseas market and customer needs, achieve sustained growth of the company's business, effectively promote the company's international market expansion, technology research and development, and global production investment.
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