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Hangzhou Lion Microelectronics (605358.SH): Multi-junction VCSEL technology is rapidly enhancing applications in Siasun Robot&Automation, vehicle Lidar, and other industrial applications.
On March 12, 2023, Hangzhou Lion Microelectronics (605358.SH) stated on the investor interaction platform that the VCSEL (Vertical Cavity Surface Emitting Laser) chips produced by Lidar Dongxin can be applied to automotive Lidar, among others. The multi-junction VCSEL technology is rapidly enhancing its applications in fields such as robotics, automotive Lidar, and other Industry applications, expected to become the mainstream light source in the future. Additionally, the two-dimensional addressable VCSEL process technology developed by Lidar Dongxin has become the first manufacturer in the Industry to mass-produce two-dimensional addressable Lidar VCSEL chips, and large-scale shipments have already been achieved. Regarding application areas,
Hangzhou Lion Microelectronics (605358.SH): The two-dimensional addressable high-power laser products of Lion East Chip can be applied in the end user robotics field.
On February 25, Gelonghui reported that Hangzhou Lion Microelectronics (605358.SH) stated on the investor interaction platform that the two-dimensional addressable high-power laser products from Lian Dongxin can be applied in the robotics field.
Hangzhou Lion Electronics Plans New Semiconductor Project in Jiaxing
Hangzhou Lion Microelectronics (605358.SH) plans to invest 1.23 billion yuan to construct a "project for an annual production of 0.96 million 12-inch silicon epitaxial wafers."
On February 14, according to Glycol Exchange, Hangzhou Lion Microelectronics (605358.SH) announced that the company plans to sign the "Investment Agreement for an Annual Production of 0.96 million 12-inch Silicon Epitaxial Wafer Production Project" with the Management Committee of the Nanhu High-tech Industrial Park in Jiaxing City, agreeing that the company will invest in the "Annual Production of 0.96 million 12-inch Silicon Epitaxial Wafer Project" in the Nanhu High-tech Industrial Park of Jiaxing City. The total planned investment for the epitaxial wafer project is 1.23 billion yuan, of which 1.12 billion yuan is for fixed assets investment.
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