Jcet Group Co., Ltd. (600584.SH) has collaborated with domestic and international major customers in the development and launch of Chiplet products.
On August 12th, GeLong Hui reported that JCET Group Co., Ltd. (600584.SH) stated on the investor interaction platform that JCET has launched the XDFOI technology platform for multi-dimensional fan-out packaging integration for 2.5D and 3D packaging requirements in 2021, and has cooperated with domestic and foreign major customers in the research and development and launch of Chiplet products. JCET has been continuously promoting diversified solutions for research and development, mass production and global layout in recent years.
JCET Group Co., Ltd. (600584.SH): XDFOI solution for Chiplet small chip packaging needs has entered mass production.
On August 9th, China Electronics Technology Group Corporation (jcet group co., ltd.) stated on the investor interaction platform that after the Moore's Law era, with the accelerated popularization of emerging technologies and applications such as 5G, artificial intelligence, and the Internet of Things, the semiconductor manufacturing technology of chip products is gradually evolving from the traditional "packaging" to the advanced packaging and testing characterized by "dense" and "interconnected", which has become a key technical support for the sustained high-speed development and continuation of Moore's Law in the integrated circuit industry. Under this background, due to the physical performance of chips approaching the limit and the slowing down of economic benefits of improving technical nodes, the focus of the semiconductor industry has gradually shifted from wafer process nodes to packaging technology innovation.
JCET Group Co., Ltd.'s (SHSE:600584) 11% Loss Last Week Hit Both Individual Investors Who Own 51% as Well as Institutions
Those Who Invested in JCET Group (SHSE:600584) Five Years Ago Are up 144%
Jcet Group Co., Ltd. (600584.SH): Has reserved relevant packaging technology for TGV.
JCET Group Co., Ltd. (600584.SH) stated on the investor interaction platform on July 16 that the company has reserved matching packaging technology for TGV.
Is It Time To Consider Buying JCET Group Co., Ltd. (SHSE:600584)?
After Leaping 26% JCET Group Co., Ltd. (SHSE:600584) Shares Are Not Flying Under The Radar
JCET Group Co., Ltd. (600584.SH) 2023 equity distribution: 0.1 yuan per share.
JCET Group Co., Ltd. (600584.SH) announced that the annual equity distribution of the company in 2023 will be implemented by exercising equity...
Is JCET Group Co., Ltd. (SHSE:600584) Trading At A 48% Discount?
JCET Group Co., Ltd. (600584.SH): has the ability to package with glass substrates and has been developing related projects.
JCET Group Co., Ltd. (600584.SH) stated on the investor interaction platform on June 7 that the company has glass substrate packaging technology capability and has been developing relevant projects.
Orient Securities: AI models on smartphones will become a trend. Generative AI is expected to reshape smart phones.
By 2024, the AI technology on mobile devices is expected to have a rapid development, making it possible to run local large models on mobile devices with the advancement of AI large model technology and the improvement of AI chip computing power for mobile phones.
JCET Group (SHSE:600584) Seems To Use Debt Quite Sensibly
Huafu Securities: Chiplet adapts to the development needs of the AI era and the future layout will continue to deepen
The Zhitong Finance App learned that Huafu Securities released a research report saying that according to SEMI data, on the one hand, global chip production capacity will increase by 6.4% by 2024, and China will lead the increase in world semiconductor production; on the other hand, equipment expenses for global front-end 300mm fabs will resume growth in 2024. Chiplet adapts to the development needs of the AI era, drastically reduces chip design and manufacturing costs through “deconstructure-restructure-reuse”, and realizes heterogeneous restructuring. Currently, Chiplet mainly uses multiple packaging technologies such as MCM, InFO, CowOS, and EMIB
JCET Group (SHSE:600584) Is Doing The Right Things To Multiply Its Share Price
Changdian Technology (600584.SH): The XDFOI high-performance packaging technology platform launched can support HBM's packaging requirements
Gelonghui, April 30丨Changdian Technology (600584.SH) said on the investor interactive platform that the XDFOI high-performance packaging technology platform launched by the company can support HBM's packaging requirements.
JCET Group Co., Ltd. Just Missed EPS By 24%: Here's What Analysts Think Will Happen Next
JCET Group's Q1 Profit Jumps 23%
JCET Group 1Q EPS 8c >600584.SH
Press Release: JCET Q1 2024 Revenue and Net Profit Achieve Double-digit Year-on-Year Growth
Press Release: Steady Development Driven by Innovation, JCET Revenue of Q4 2023 Hits a Record High
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