The company was founded in March 2018 and is headquartered in Shaoxing, Zhejiang. It is a manufacturer focusing on power, sensing and transmission applications, providing foundry services for analog chip and module packaging. The company uses foundry as a starting point and extends downward to module packaging to provide domestic and foreign customers with one-stop foundry solutions, provide a complete manufacturing platform for semiconductor product companies in the fields of power, sensing and transmission, and support customer R&D and large-scale mass production. The company provides one-stop chip and module OEM services from design services, wafer manufacturing, module packaging, application verification to reliability testing for industrial control fields such as new energy vehicles, wind and solar storage and power grids, and high-end consumer goods markets. The company's products are integrated circuit wafer manufacturing, packaging testing, and R&D services.
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